A standardized component that integrates 2-12 independent MLCC (chip multilayer ceramic capacitor) chips into a single insulated package through precision technology, with common terminals or independent lead out electrodes.
Features:
1. High density&space saving
1 4-channel capacity=4 independent MLCCs, saving 70%+PCB area.
Suitable for lightweight products such as mobile phones, watches, laptops, etc.
2. Efficient assembly
Multiple capacitors can be assembled in one go, improving SMT efficiency and reducing tray management.
Reduce the risk of wrong materials and missing stickers.
3. Electrical consistency
Manufacturing in the same batch and process, with highly consistent capacitance/temperature characteristics.
Suitable for symmetrical circuits such as differential pairs and filter arrays.
4. High frequency/EMI advantages
Short internal electrodes, lower ESL/ESR, and better high-frequency impedance.
Reduce parasitic inductance, suppress crosstalk, and improve EMI performance.
5. cost optimization
The cost of bulk packaging is lower than the total cost of individual units, and the BOM cost is also lower.
Applications：
1. Consumer Electronics (Mobile/PC/Wearable)
Motherboard power decoupling array (with a large capacity of 0.1 μ F for CPU/GPU peripherals).
Interface circuit (USB/HDMI) ESD filtering+impedance matching.
2. Automotive Electronics
ECU、 Multi channel signal filtering of sensors.
Vehicle grade high reliability, high temperature resistance (-55 ℃~150 ℃) application.
3. Industrial/Communication
Multi channel power filtering for servers and base stations.
PLC、 Instrument I/O port anti-interference.
4. other
Audio differential coupling/isolation.
High frequency RF matching network.
